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Lot No: 1.0 PCB GRP :[PRE-BID EMD for Insulated copper wire scrap for Airtel] Lot Name: BIH_MO_Cabl
Tender Notice
Tender Detail
Lot No: 1.0 PCB GRP :[PRE-BID EMD for Insulated copper wire scrap for Airtel] Lot Name: BIH_MO_Cables_CPRI Cable
Tendering Authority
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Tender Category
Scrap Tenders & Auction Notice
Publish Date
31 Jul 2026
Deadline
04 Aug 2026
Country
India
TenderNews Ref. No.
6375516260731-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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