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Lot No: 11.0 PCB GRP :[PRE-BID EMD for Plastic Scrap for Airtel] Lot Name: PUN_MO_Plastic_Sunpack
Tender Notice
Tender Detail
Lot No: 11.0 PCB GRP :[PRE-BID EMD for Plastic Scrap for Airtel] Lot Name: PUN_MO_Plastic_Sunpack
Tendering Authority
Login To View Detail Description
Tender Category
Scrap Tenders & Auction Notice
Publish Date
12 Feb 2026
Deadline
18 Feb 2026
Country
India
TenderNews Ref. No.
5801816260212-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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