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Multi-project wafer (MPW) trial fabrication of dedicated chips for security control of cyber-physic
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Tender Detail
Multi-project wafer (MPW) trial fabrication of dedicated chips for security control of cyber-physical systems
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Tender Category
Other
Publish Date
01 Jun 2026
Deadline
24 Jun 2026
Country
CHINA
TenderNews Ref. No.
3473616260601-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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