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University Integrated Circuit High-Precision Automatic Die Bonding Machine Procurement Project
Tender Notice
Tender Detail
University Integrated Circuit High-Precision Automatic Die Bonding Machine Procurement Project
Tendering Authority
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Tender Category
Other
Publish Date
08 Nov 2025
Deadline
27 Nov 2025
Country
CHINA
TenderNews Ref. No.
3205116251108-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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