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Biological Science and Medical Engineering High-Throughput 3D Organoid Imaging Analysis Platform Pu
Tender Notice
Tender Detail
Biological Science and Medical Engineering High-Throughput 3D Organoid Imaging Analysis Platform Purchase
Tendering Authority
Login To View Detail Description
Tender Category
Other
Publish Date
22 Jul 2026
Deadline
13 Aug 2026
Country
CHINA
TenderNews Ref. No.
2993117260722-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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