Supply and installation of equipment for the manufacture of interconnection substrates for the Labo

Tender Notice

Tender Detail
Supply and installation of equipment for the manufacture of interconnection substrates for the Laboratory of Manufacturing and Validation of High Security Multi-chip Electronic Devices for Defense, intended for the Institute of Microelectronics of
Tendering Authority
Tender Category
Other
Publish Date
25 Nov 2025
Deadline
12 Jan 2026
Country
spain
TenderNews Ref. No.
2826716251125-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
EUR 1398000
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