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Multi-Project - Wafer Semiconductor Chip Packaging and Chip Electrical Characteristics Evaluation S
Tender Notice
Tender Detail
Multi-Project - Wafer Semiconductor Chip Packaging and Chip Electrical Characteristics Evaluation Service
Tendering Authority
Login To View Detail Description
Tender Category
Other
Publish Date
11 Sep 2026
Deadline
14 Sep 2026
Country
Korea south
TenderNews Ref. No.
2820816260911-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
KRW 39336000
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