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Acquisition of chip fabrication of Pipelined ADC with Temperature-Compensated amplifier using TSMC
Tender Notice
Tender Detail
Acquisition of chip fabrication of Pipelined ADC with Temperature-Compensated amplifier using TSMC 28 nm CMOS logic HPC plus process for IME of the University of Macau
Tendering Authority
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Tender Category
Other
Publish Date
20 May 2026
Deadline
22 May 2026
Country
China
TenderNews Ref. No.
2655016260520-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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