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Integrated Circuit Design Automation Technology Innovation Center: SPICE Simulation Computing Serve
Tender Notice
Tender Detail
Integrated Circuit Design Automation Technology Innovation Center: SPICE Simulation Computing Server Procurement Project
Tendering Authority
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Tender Category
Other
Publish Date
24 Apr 2026
Deadline
15 May 2026
Country
CHINA
TenderNews Ref. No.
2286816260424-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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