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procurement of 12 inch silicon wafer automatic edge removal machine
Tender Notice
Tender Detail
procurement of 12 inch silicon wafer automatic edge removal machine
Tendering Authority
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Tender Category
Global Tenders
Publish Date
05 Aug 2026
Deadline
28 Aug 2026
Country
CHINA
TenderNews Ref. No.
170051260805-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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