tendernews getting a chip made for a wide input dual path cmos rectifier for harvesting rf energy using tsmc`s tender tenders from china Tender

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Tender Detail	Getting a chip made for a wide-input dual-path CMOS rectifier for harvesting RF energy using TSMC`s 28 nm CMOS Logic HPC+ process
Tendering Authority	Login To View Detail Description
Tender Category	Other
Publish Date	09 Jul 2026
Deadline	13 Jul 2026
Country	China
TenderNews Ref. No.	1435716260709-0
Document Fees	Refer Document.
EMD	Refer Document.
Tender Value	Refer Document.
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