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Procurement of an integrated system for spin coating, baking, developing, and removing adhesive for
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Tender Detail
Procurement of an integrated system for spin coating, baking, developing, and removing adhesive for atomically thick materials, and a single-wafer wafer cleaning system for non-silicon new materials for the University of Science and Technology Beij
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Tender Category
Other
Publish Date
21 Nov 2025
Deadline
10 Dec 2025
Country
CHINA
TenderNews Ref. No.
1407316251121-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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