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develop and test compact switch technology at Ku- and Ka-band, compatible with on-chip integration.
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Tender Detail
develop and test compact switch technology at Ku- and Ka-band, compatible with on-chip integration. Two 4-by-4 switch matrix demonstrators will be designed, manufactured and tested. Targeted Improvements: Achieve a high degree of miniaturisation, a
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Tender Category
Other
Publish Date
29 Mar 2020
Deadline
11 Jun 2020
Country
France
TenderNews Ref. No.
979117200329-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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