tendernews sale of datacon 2200 evo multichip bonder tender tenders from hong kong Tender

Tender Notice
Tender Detail	sale of DataCon 2200 EVO Multichip Bonder
Tendering Authority	Login To View Detail Description
Tender Category	Other
Publish Date	16 May 2022
Deadline	27 May 2022
Country	Hong Kong
TenderNews Ref. No.	751817220516-0
Document Fees	Refer Document.
EMD	Refer Document.
Tender Value	Refer Document.
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Tender Notice