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High-aspect-ratio silicon dioxide thin film chemical vapor deposition equipment 2 Silica thin film
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Tender Detail
High-aspect-ratio silicon dioxide thin film chemical vapor deposition equipment 2 Silica thin film chemical vapor deposition equipment using tetraethyl silicate as reactant in front-end plasma enhanced mode 1 Back-end low dielectric constant silico
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Tender Category
Other
Publish Date
06 Aug 2020
Deadline
31 Aug 2020
Country
China
TenderNews Ref. No.
1376417200806-0
Document Fees
Refer Document.
EMD
Refer Document.
Tender Value
Refer Document.
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